TG-G3.0-01 Heatsink thermal paste grease Keep your computer's CPU cool Practical syringe for easy application Features Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 3 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance <0.205 ° C-in2 / W Density: > 2.5 Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1 Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 ° C Operating Temperature: -50 ~ 240 ° C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%
